Tenders/Tianxin Interconnection Technology Co., Ltd. Project - Wafer Electroplating Gold Machine [Re-tender] - International Tender Announcement (2)

Open🇨🇳ChinaSupplies

Tianxin Interconnection Technology Co., Ltd. Project - Wafer Electroplating Gold Machine [Re-tender] - International Tender Announcement (2)

Auto-translated from Chinese

Original title: 天芯互联科技有限公司项目-晶圆电镀金机【重新招标】 - 国际招标公告(2)

Published: Apr 2, 2026

Updated: May 9, 2026

Source: ChinaBidding

Summary

Translated

This is a re-tender announcement for a wafer electroplating gold machine for Tianxin Interconnection Technology Co., Ltd. The project is categorized under the 'Computers, Communications, and Other Electronic Equipment Manufacturing' industry and is located in Guangdong Province, China. Funding will be provided via 'Spot Exchange'. The requirement is for specialized equipment used in semiconductor manufacturing to apply gold plating onto wafers. This re-tender suggests that the initial procurement attempt was unsuccessful. Tianxin Interconnection Technology Co., Ltd. is seeking international suppliers capable of providing high-precision electroplating machinery essential for producing advanced semiconductor devices. The tender invites qualified bidders to submit proposals for this critical equipment.

Description

0730-264010SZ0072/01,天芯互联科技有限公司项目-晶圆电镀金机【重新招标】 | 行业: 计算机、通信和其他电子设备制造业 | 地区: 中国广东省 | 资金来源: 现汇

Find tenders like this automatically

Set up alerts and filters that match your business — never miss a relevant opportunity again.

See plans

About This Opportunity

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.