Nantong Shennan Circuit Co., Ltd. Project - Laser Direct Imaging Machine (Outer Layer) - International Tender Announcement

This international tender concerns the procurement of a Laser Direct Imaging (LDI) machine specifically for outer layer applications for Nantong Shennan Circuit Co., Ltd. The project is located in Jiangsu Province, China, funded by spot exchange, and falls within the 'Computer, communication and other electronic equipment manufacturing' industry. This LDI machine is intended for the direct imaging of circuit patterns onto the outer layers of printed circuit boards (PCBs). Unlike traditional mask-based photolithography, LDI uses lasers to create patterns directly, offering superior resolution, precision, and flexibility, particularly for fine-line circuitry and complex designs common in advanced PCBs. The tender seeks a high-performance LDI system optimized for outer layer imaging, capable of high throughput and accuracy. This acquisition is critical for Nantong Shennan Circuit Co., Ltd. to enhance its production capabilities for high-density interconnect (HDI) boards and maintain its position in the competitive electronics manufacturing market. Suppliers are invited to offer cutting-edge LDI technology.