BEoL Layer Transfer, fully automated (IZM-135) - PR1108543-3460-P

1x BEoL Layer Transfer, fully automated To meet the strong demand for a reliable processing and handling of semiconductor wafers with thicknesses down to below 20 µm, the temporary bonding of device wafers on thick carrier wafers is a well-established approach. Common temporary carrier systems are glass wafers in combination with polymer-based adhesion layers. In case of glass-carriers, for the final wafer debond the temporary bond layers can be manipulated via UV-laser to lower the bond strength. The aim of the machine specified here, is to perform the debonding via infrared (IR) light-based laser, so that silicon-wafers can be used as temporary carriers.

The purpose of this equipment specification is to define basic requirements for a Fully automatic IR-Laser Debonder for the debonding of, among others, • silicon wafers and wafers of other types of materials • device wafers of down to below 20 µm thickness • inorganic RDL-first and Back-End-of-Line (BEoL) layers temporarily bonded and assembled on different sorts of Si carrier wafers using different bond layers. The temporarily bonded wafer pairs will be mounted on film frames, so that they are delivered to the laser debonder in standardized film frame cassettes. The debonding system must be able to run fully-automatically the following series of steps. • Loading of film frame from film frame cassette • Mechnical pre-alignment and wafer ID-reading • Handling of film frame into laser debonding station • Laser treatment • Unloading film frame with laser treated wafer into film frame cassette For high throughput, the machine must be able to run the laser process on one wafer pair and the pre-alignment of another wafer pair on film frame in parallel. Furthermore, the software of the system must enable the programming of different automatic strings of actions within and in-between the different machine stations and modules. The programming of recipes must be possible within an appropriate range of options and parameters as required for research and development (R&D). Optionale Features: - A FOUP loading port for SEMI-compliant 300 mm FOUPs (LV item 3.2) - Modules and handling stations - 300 mm separation module (LV item 4.3) - Modules and handling stations - 200 mm separation module (LV item 4.4) - Additional end effectors for loading and unloading the film frames (LV item 4.5.2) - End effector for handling carrier wafers (LV item 4.5.3) - Additional flat touchscreen (LV item 5.5) - Creation and editing of recipes on a second computer (LV item 5.33) - Visualisation of process parameters in diagrams on a second computer (LV item 5.34) - Switching the laser source to idle mode when no process is running (LV item 7.2)