Tenders/Glass-Based Packaging Substrate R&D Pilot Line Project - International Tender Announcement (1)

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Glass-Based Packaging Substrate R&D Pilot Line Project - International Tender Announcement (1)

Auto-translated from Chinese

Original title: 玻璃基封装载板研发试验线项目 - 国际招标公告(1)

Published: Apr 1, 2026

Updated: May 10, 2026

Source: ChinaBidding

Summary

Translated

This international tender, reference number 4197-254BOECG0001/42, announces a project for the establishment of a Research and Development (R&D) pilot line for glass-based packaging substrates. The project is located in Beijing, China, and falls under the manufacturing sector of computers, communication, and other electronic equipment. The funding is provided through spot exchange. The tender seeks proposals for the design, supply, installation, and commissioning of a comprehensive pilot line, including all necessary equipment and technologies for the R&D of advanced glass-based packaging substrates. This initiative aims to advance the capabilities in high-performance electronic packaging materials within China.

Description

4197-254BOECG0001/42,玻璃基封装载板研发试验线项目 | 行业: 计算机、通信和其他电子设备制造业 | 地区: 中国北京市 | 资金来源: 现汇

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About This Opportunity

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.