Tenders/Shanghai E-Chip Semiconductor Co., Ltd. Metal Film Sputtering Equipment - International Tender Announcement(2)

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Shanghai E-Chip Semiconductor Co., Ltd. Metal Film Sputtering Equipment - International Tender Announcement(2)

Auto-translated from Chinese

Original title: 上海易启芯程半导体有限公司金属薄膜溅射设备 - 国际招标公告(2)

Published: Sep 28, 2026

Updated: Sep 28, 2026

Source: ChinaBidding

About This Opportunity

This is a supplies contract in the information and communication technology and trade and industry sectors, with a focus on Manufacturing. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This international tender, originating from China, concerns the procurement of metal film sputtering equipment for Shanghai E-Chip Core Semiconductor Co., Ltd. The contracting authority operates within the special equipment manufacturing sector, located in Shanghai. The procurement is funded through spot exchange, suggesting international sourcing. Metal film sputtering equipment is crucial in semiconductor manufacturing for depositing thin metal layers onto substrates. Typical requirements for such equipment include high precision, uniformity of film thickness, excellent control over deposition rates, vacuum integrity, and compatibility with various target materials and substrate sizes. The tender will likely specify detailed technical parameters such as target utilization efficiency, base pressure, process gas control, substrate handling mechanisms, and potential for in-situ monitoring. Suppliers are expected to possess significant experience and a strong reputation in providing advanced semiconductor fabrication equipment. The scope of supply may also include installation, process qualification, operator training, and comprehensive after-sales service and maintenance to ensure reliable production.

Data provenance

This notice is sourced from ChinaBidding and was originally published on September 28, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

Frequently asked questions about this tender

How can I submit a bid?

Visit ChinaBidding to access the full notice, required documents, and submission instructions provided by the contracting authority.

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.