Tenders/Guangzhou Guangxin Packaging Substrate Co., Ltd. Project - Reflow Oven - International Tender Announcement(2)

Open🇨🇳ChinaSupplies

Guangzhou Guangxin Packaging Substrate Co., Ltd. Project - Reflow Oven - International Tender Announcement(2)

Auto-translated from Chinese

Original title: 广州广芯封装基板有限公司项目-回流炉 - 国际招标公告(2)

Published: Sep 23, 2026

Updated: Sep 23, 2026

Source: ChinaBidding

About This Opportunity

This is a supplies contract in the information and communication technology and trade and industry sectors, with a focus on Software, Manufacturing and Industrial Machinery. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This international tender concerns the procurement of a Reflow Oven for Guangzhou Guangxin Packaging Substrate Co., Ltd., located in Guangdong Province, China. The project is categorized under the manufacturing of computers, communication, and other electronic equipment. The acquisition will be financed through foreign exchange. The tender seeks a high-quality reflow oven, a crucial piece of equipment in the electronics assembly process, used for soldering surface-mount components to printed circuit boards (PCBs) by passing them through controlled heating zones. The specifications typically include precise temperature control capabilities across multiple heating zones, temperature uniformity, conveyor belt speed adjustability, cooling zones, and profiling software for process optimization. Bidders are expected to demonstrate the oven's reliability, energy efficiency, safety features, and ease of maintenance. Proposals will be evaluated based on technical compliance with specified thermal profiles, throughput capacity, consistency, vendor support, warranty, and delivery timelines. Experience in supplying reflow ovens for demanding electronics manufacturing applications, particularly in the packaging substrate sector, will be a key consideration. The contracting authority aims to secure a robust and precise reflow oven to ensure high-yield, high-quality soldering for their production lines.

Data provenance

This notice is sourced from ChinaBidding and was originally published on September 23, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

Frequently asked questions about this tender

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit ChinaBidding to access the full notice, required documents, and submission instructions provided by the contracting authority.