Tenders/Zhuhai Chifang Electronics Co., Ltd. Project - Gantry Electro-Chemical Wire (Second Tender) - International Tender Announcement(2)

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Zhuhai Chifang Electronics Co., Ltd. Project - Gantry Electro-Chemical Wire (Second Tender) - International Tender Announcement(2)

Auto-translated from Chinese

Original title: 珠海驰方电子有限公司项目-龙门电金线(二次招标) - 国际招标公告(2)

Published: Nov 12, 2026

Updated: Nov 12, 2026

Source: ChinaBidding

About This Opportunity

This is a supplies contract in the information and communication technology, trade and industry and general supplies sectors, with a focus on Manufacturing. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This international tender, announced by chinabidding as a second round of bidding, concerns the procurement of a gantry gold wire bonder for a project at Zhuhai Chifang Electronics Co., Ltd. The tender originates from China, specifically Guangdong province. The industry involved is the manufacturing of computers, communication, and other electronic equipment. This procurement focuses on acquiring specialized equipment for semiconductor packaging or advanced electronic assembly processes. A gantry gold wire bonder is used to connect semiconductor chips to their packaging substrates or lead frames using fine gold wires, a critical step in producing integrated circuits and electronic components. Typical requirements for such equipment include high precision bonding accuracy, speed, reliability, advanced vision systems for alignment, and compatibility with various semiconductor package types. Bidders must provide detailed technical specifications, including bonding parameters, throughput, and quality control features. The tender will likely require suppliers to offer installation, training, and ongoing maintenance services. The funding is through spot exchange, indicating a direct cash payment. This procurement aims to enhance the electronic manufacturing capabilities of Zhuhai Chifang Electronics, seeking suppliers with proven expertise in advanced semiconductor assembly equipment.

Data provenance

This notice is sourced from ChinaBidding and was originally published on November 12, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

Frequently asked questions about this tender

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit ChinaBidding to access the full notice, required documents, and submission instructions provided by the contracting authority.