Non-Contact Silicon Thickness Measurement Equipment - International Tender Announcement (2)

This international tender, originating from China, is for the procurement of non-contact silicon thickness measurement equipment. The contracting authority is located in Jiangsu Province, China, and the tender falls under the instrument manufacturing industry. The acquisition will be financed through spot exchange. This equipment is crucial for quality control and process monitoring in semiconductor manufacturing, where precise measurement of silicon wafer thickness is required. The tender will specify requirements for non-contact measurement technology, ensuring no damage or contamination to the wafer surface. Key technical specifications will include measurement range, accuracy, resolution, measurement speed, and compatibility with various wafer sizes (likely including 8-inch or larger). The system should offer high repeatability and reliability for in-line or at-line inspection. Bidders are expected to provide detailed technical documentation, including the measurement principle, performance data, and software capabilities for data analysis and reporting. The tender will assess the supplier's manufacturing expertise in metrology equipment, their quality assurance processes, and their ability to provide installation, calibration, training, and ongoing technical support. Evaluation criteria will focus on measurement accuracy, speed, reliability, ease of integration, and overall cost-effectiveness.