Tenders/Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I) - 3 Laser Processing Machines (Second Tender) Bid Evaluation Results Announcement
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Nantong Kangyuan Integrated Circuit Packaging Substrate Project (Phase I) - 3 Laser Processing Machines (Second Tender) Bid Evaluation Results Announcement

Auto-translated from Chinese
Original title: 南通康源集成电路封装载板项目(一期)-激光加工机3台(二次招标)评标结果公示公告
Published: Mar 10, 2026
Updated: May 21, 2026
Source: ChinaBidding

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About This Opportunity

Translated

This announcement concerns the bid evaluation results for the procurement of three laser processing machines, which is the second tender for Phase I of the Nantong Kangyuan Integrated Circuit Packaging Substrate Project. The project is located in Jiangsu Province, China, within the Computer, Communication, and Other Electronic Equipment Manufacturing industry. The procurement is funded by spot exchange. The tender, identified by reference number 0730-264012SZ0029/01, specifically targets the acquisition of laser processing machinery essential for the production of packaging substrates used in integrated circuits. This equipment is critical for the advanced manufacturing processes required in the semiconductor industry, enabling precise cutting and processing of materials. The announcement signifies the completion of the evaluation process for this second tender, indicating that a preferred bidder or a decision on the procurement has been reached. The project aims to enhance Nantong Kangyuan's capabilities in the integrated circuit packaging sector, contributing to the growth of China's high-tech manufacturing industry. The use of spot exchange as the funding source suggests that the procurement is being managed with readily available foreign currency, likely to facilitate the acquisition of specialized imported equipment or to streamline international transactions. This procurement is a key step in the development of Nantong Kangyuan's integrated circuit packaging substrate production capacity.

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. This contract has already been awarded. The information is published for transparency and market intelligence purposes.

Description

Original language: Chinese

This tender announcement concerns the procurement of three laser processing machines for the first phase of the Nantong Kangyuan Integrated Circuit Packaging Substrate Project. This is a secondary tender process, indicating that a previous solicitation may not have resulted in a successful award. The project is situated in Jiangsu Province, China, within the Computer, Communication, and Other Electronic Equipment Manufacturing industry. Funding for this acquisition is confirmed to be from spot exchange, implying readily available capital.

The contracting authority is seeking specialized laser processing equipment essential for the production of integrated circuit packaging substrates. Such equipment typically requires high precision, advanced control systems, and the capability to perform intricate cutting, engraving, or ablation tasks on semiconductor materials. Prospective bidders should anticipate requirements related to machine specifications, performance capabilities, technical support, after-sales service, warranty provisions, and delivery timelines. Experience in supplying similar machinery to the electronics manufacturing sector, particularly for semiconductor applications, will likely be a key consideration. Compliance with relevant industry standards and certifications for equipment operating in a cleanroom environment may also be stipulated.

This procurement represents a significant investment in advanced manufacturing capabilities for China's growing semiconductor industry.

Data provenance

This notice is sourced from ChinaBidding and was originally published on March 10, 2026. Last refreshed 35 days ago. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

Frequently asked questions about this tender

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit ChinaBidding to access the full notice, required documents, and submission instructions provided by the contracting authority.

Is this tender still open?

No — the contracting authority has selected an awardee for this notice. The record is kept for transparency and market intelligence.

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