Tenders/Public Bidding Announcement for Ultra-High Resolution Micro-Scale Interconnected Packaging System Procurement Project of Beijing University of Science and Technology

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Public Bidding Announcement for Ultra-High Resolution Micro-Scale Interconnected Packaging System Procurement Project of Beijing University of Science and Technology

Auto-translated from Chinese

Original title: 北京科技大学超高分辨微尺度互联封装系统公开招标公告

北京科技大学

Published: Nov 9, 2026

Updated: Nov 12, 2026

Source: China CCGP

About This Opportunity

This is a supplies contract in the Research, architecture and engineering and information and communication technology sectors, with a focus on IT support, Laboratories and R&D equipment. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through China CCGP, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the Research sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Auto-translated from Chinese

Beijing University of Science and Technology, with HUA CAI INTERNATIONAL BIDDING GROUP CO., LTD. as the tender agent, is conducting a public tender for the procurement of an ultra-high resolution micro-scale interconnected packaging system in China. This acquisition is driven by the university's research and development needs in advanced materials science and microelectronics. The system is expected to be a sophisticated piece of laboratory equipment designed for precise manipulation, interconnection, and packaging at the micro-scale, likely for applications in semiconductor research, advanced packaging technologies, or nanotechnology. Typical requirements for such a high-tech procurement include detailed technical specifications, performance guarantees, and compatibility with existing laboratory infrastructure. Bidders must demonstrate advanced manufacturing capabilities, rigorous quality control, and the ability to provide comprehensive installation, training, and after-sales technical support. Compliance with international standards for precision instrumentation and laboratory equipment is expected. The tender will likely require suppliers to provide detailed technical documentation, evidence of successful installations elsewhere, and a robust warranty. This represents a significant opportunity for manufacturers of advanced scientific instrumentation.

Data provenance

This notice is sourced from China CCGP and was originally published on November 9, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

About 北京科技大学

北京科技大学 has issued 19 procurement notices on BidsFactory, including 6 currently open and 0 awarded contracts. Activity concentrates in Architecture & Engineering Services, General Supplies & Services, and Research & Innovation. All notices are published for China. Notices are distributed via China CCGP. Most recent publication: November 9, 2026.

Frequently asked questions about this tender

How can I submit a bid?

Visit China CCGP to access the full notice, required documents, and submission instructions provided by the contracting authority.

Who is the contracting authority?

This notice was issued by 北京科技大学 in China. The authority is responsible for evaluating bids, awarding the contract, and managing performance.

What type of contract is this?

This is a Supplies contract in the Research & Innovation sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.