Tenders/Peking University Micro-Nano Fabrication Technology National Key Laboratory Wire Bonder Procurement Project Public Tender Announcement

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Peking University Micro-Nano Fabrication Technology National Key Laboratory Wire Bonder Procurement Project Public Tender Announcement

Auto-translated from Chinese

Original title: 北京大学微米纳米加工技术全国重点实验室金丝球焊机采购项目公开招标公告

北京大学

Published: Sep 20, 2026

Updated: Sep 20, 2026

Source: china_ccgp

About This Opportunity

This is a supplies contract in the Research and general supplies sectors, with a focus on Laboratories and Office Equipment. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through China CCGP, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the Research sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This tender is an open bidding process for the procurement of a wire bonder for the National Key Laboratory of Micro-Nano Fabrication Technology at Peking University in China. The contracting authority is Peking University, with Oriental International Tendering Co., Ltd. serving as the tender agent. The procurement seeks a specialized piece of equipment, a wire bonder, crucial for micro and nanotechnology research and fabrication. Wire bonders are used to connect semiconductor devices and integrated circuits. Typical requirements for such high-tech equipment include extremely precise bonding capabilities (e.g., gold wire bonding), advanced vision systems, compatibility with various package types, and high throughput. The tender also covers installation, operational training, and comprehensive after-sales service and maintenance. Bidders are expected to provide equipment from leading manufacturers, demonstrating technical expertise and the ability to support advanced research applications in microelectronics and nanotechnology.

Data provenance

This notice is sourced from China CCGP and was originally published on September 20, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

About 北京大学

北京大学 has issued 25 procurement notices on BidsFactory, including 5 currently open and 0 awarded contracts. Activity concentrates in General Supplies & Services, Research & Innovation, and Information & Communication Technology. All notices are published for China. Notices are distributed via China CCGP. Most recent publication: September 20, 2026.

Frequently asked questions about this tender

How can I submit a bid?

Visit China CCGP to access the full notice, required documents, and submission instructions provided by the contracting authority.

Who is the contracting authority?

This notice was issued by 北京大学 in China. The authority is responsible for evaluating bids, awarding the contract, and managing performance.

What type of contract is this?

This is a Supplies contract in the Research & Innovation sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.