Tenders/Chongqing Founder High-Density Electronics Co., Ltd. Project - Inner Layer LDI Connection (Second Tender) - International Tender Announcement (2)

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Chongqing Founder High-Density Electronics Co., Ltd. Project - Inner Layer LDI Connection (Second Tender) - International Tender Announcement (2)

Auto-translated from Chinese

Original title: 重庆方正高密电子有限公司项目-内层LDI连线(二次招标) - 国际招标公告(2)

Published: Apr 2, 2026

Updated: May 9, 2026

Source: ChinaBidding

Summary

Translated

Chongqing Founder High-Density Electronics Co., Ltd. is conducting a second tender for the procurement of inner layer LDI (Laser Direct Imaging) connection equipment. This project falls within the 'Computers, Communications, and Other Electronic Equipment Manufacturing' sector and is located in Chongqing, China. The financing will be through 'Spot Exchange'. LDI technology is crucial for high-precision circuit board manufacturing, enabling direct imaging onto the substrate without the need for traditional masks. This second tender indicates a renewed effort to acquire the necessary equipment after the initial bidding process. The company seeks international suppliers who can provide advanced LDI connection systems for their high-density electronic component production.

Description

0730-264012SZ0062/02,重庆方正高密电子有限公司项目-内层LDI连线(二次招标) | 行业: 计算机、通信和其他电子设备制造业 | 地区: 中国重庆市 | 资金来源: 现汇

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About This Opportunity

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.