Tenders/Maxell Electronic Materials (Zhengzhou) Co., Ltd. Annual Output of 3.6 Million Pieces of 8-inch Semiconductor Specialty Silicon Polishing Wafer Project AP Back Sealing Furnace Procurement - International Tender Announcement
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Maxell Electronic Materials (Zhengzhou) Co., Ltd. Annual Output of 3.6 Million Pieces of 8-inch Semiconductor Specialty Silicon Polishing Wafer Project AP Back Sealing Furnace Procurement - International Tender Announcement

Auto-translated from Chinese
Original title: 麦斯克电子材料(郑州)有限公司年产360万片8英寸半导体特色硅抛光片项目AP背封炉采购 - 国际招标公告(2)
Published: Apr 1, 2026
Updated: May 9, 2026
Source: ChinaBidding

Summary

Translated
International tender for an AP back sealing furnace for Maxell Electronic Materials' 8-inch semiconductor silicon wafer project in Henan Province, China.

Description

1354-264HXZBG2601,麦斯克电子材料(郑州)有限公司年产360万片8英寸半导体特色硅抛光片项目AP背封炉采购 | 行业: 计算机、通信和其他电子设备制造业 | 地区: 中国河南省 | 资金来源: 现汇

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About This Opportunity

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Key Details

Contract Type
Supplies
Eligibility
Firms / Consortiums
Language
Chinese

Source

chinabidding
ChinaBidding
Public Procurement

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