Tenders/Semiconductor chip manufacturing service [HV BCD PMIC DIE]

Semiconductor chip manufacturing service [HV BCD PMIC DIE]

Auto-translated from Korean
Original title: 반도체 칩 제작 서비스 [HV BCD PMIC DIE]
울산과학기술원
Published: Mar 20, 2026
Updated: May 9, 2026
Source: south_korea_pps

Description

반도체 칩 제작 서비스 [HV BCD PMIC DIE]

Reference: 1100002766

Contract method: 일반경쟁

Bidding method: 직찰

Ordering institution: 울산과학기술원

Opening place: 국가종합전자조달시스템(나라장터)

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About This Opportunity

This is a supplies contract in the general supplies sector. Located in South Korea, Asia, this opportunity is open to firms and consortiums.

Published through South Korea PPS, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the general supplies sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Key Details

Contract Type
Supplies
Eligibility
Firms / Consortiums
Language
Korean

Source

south_korea_pps
south_korea_pps
Official Source

Contracting Authority

울산과학기술원
🇰🇷South Korea

Contact

Contact Person
김찬우

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