Tenders/IPMS-MRS14.4.1: Wafer Mounter

IPMS-MRS14.4.1: Wafer Mounter

Fraunhofer Institut Photonische Mikrosysteme IPMS

Published: Oct 28, 2026

Updated: Oct 29, 2026

Source: DÖE Bekanntmachungsservice (Germany)

About This Opportunity

This is a supplies contract in the architecture and engineering and trade and industry sectors, with a focus on Manufacturing and Industrial Machinery. Located in Germany, Europe, this opportunity is open to firms and consortiums.

Published through DÖE Bekanntmachungsservice (Germany), a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the architecture and engineering sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

This tender, identified as IPMS-MRS14.4.1, originates from Germany (source: oeffentlichevergabe_de) and concerns the supply of a Wafer Mounter. A wafer mounter is a piece of equipment used in the semiconductor manufacturing process to precisely attach semiconductor wafers to carriers or substrates. This is a critical step in wafer handling and subsequent processing. The tender requires the delivery of a specific model or equivalent, indicated by the designation 'IPMS-MRS14.4.1: Wafer Mounter'. Key requirements will include detailed technical specifications related to mounting accuracy, speed, compatibility with different wafer sizes and carrier types, and cleanroom compatibility (e.g., class requirements). The equipment must ensure precise alignment and secure attachment without damaging the wafer. Bidders are expected to provide comprehensive product documentation, including operational parameters and performance data. The tender may also specify requirements for installation, calibration, operator training, warranty, and after-sales service. The contracting authority will evaluate proposals based on the technical capabilities and specifications of the wafer mounter, reliability, vendor support, and overall cost.

Data provenance

This notice is sourced from DÖE Bekanntmachungsservice (Germany) and was originally published on October 28, 2026. Last refreshed today. Original language: German. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

About Fraunhofer Institut Photonische Mikrosysteme IPMS

Fraunhofer Institut Photonische Mikrosysteme IPMS has issued 10 procurement notices on BidsFactory, including 6 currently open and 0 awarded contracts. Activity concentrates in Information & Communication Technology, General Supplies & Services, and Architecture & Engineering Services. All notices are published for Germany. Notices are distributed via service.bund.de (Germany) and DÖE Bekanntmachungsservice (Germany). Most recent publication: October 28, 2026.

Frequently asked questions about this tender

Who is the contracting authority?

This notice was issued by Fraunhofer Institut Photonische Mikrosysteme IPMS in Germany. The authority is responsible for evaluating bids, awarding the contract, and managing performance.

What type of contract is this?

This is a Supplies contract in the Architecture & Engineering Services sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in Germany. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit DÖE Bekanntmachungsservice (Germany) to access the full notice, required documents, and submission instructions provided by the contracting authority.