Tenders/Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

Open🇬🇧United KingdomSupplies

Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

University of Strathclyde

Published: Aug 3, 2026

Updated: Aug 6, 2026

Source: Public Contracts Scotland

About This Opportunity

This is a supplies contract in the agriculture and food security, transport and logistics and legal services sectors, with a focus on Food Processing, Logistics and Intellectual Property. Located in United Kingdom, Europe, this opportunity is open to firms and consortiums. Proposals must be submitted before September 4, 2026.

Published through Public Contracts Scotland, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the agriculture and food security sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging. Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an automatic submicron flip-chip die bonder capable of performing die attachment and flip chip bonding for photonics packaging application.

Data provenance

This notice is sourced from Public Contracts Scotland and was originally published on August 3, 2026. Last refreshed today. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

About University of Strathclyde

University of Strathclyde has issued 596 procurement notices on BidsFactory, including 66 currently open and 287 awarded contracts. Activity concentrates in Information & Communication Technology, General Supplies & Services, and Research & Innovation. All notices are published for United Kingdom. Notices are distributed via Public Contracts Scotland, UK FTS - Find a Tender Service, and TED - Tenders Electronic Daily (EU). Most recent publication: August 6, 2026.

Frequently asked questions about this tender

Where will the contract be performed?

The contract is for delivery in United Kingdom. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit Public Contracts Scotland to access the full notice, required documents, and submission instructions provided by the contracting authority.

When does this tender close?

The submission deadline is September 4, 2026. You have 29 days left to prepare and submit your proposal to the contracting authority.

Who is the contracting authority?

This notice was issued by University of Strathclyde in United Kingdom. The authority is responsible for evaluating bids, awarding the contract, and managing performance.

What type of contract is this?

This is a Supplies contract in the Agriculture & Food Security sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.