Tenders/UCIe-to-Serdes I/O Chip and Test Board Procurement Project Tender Announcement

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UCIe-to-Serdes I/O Chip and Test Board Procurement Project Tender Announcement

Auto-translated from Chinese

Original title: UCIe-to-SerdesI/O芯片和测试板采购项目招标公告

zycgr21071303

Published: Nov 4, 2026

Updated: Nov 4, 2026

Source: China CCGP

About This Opportunity

This is a supplies contract in the information and communication technology, architecture and engineering and energy and power sectors, with a focus on Transmission Distribution. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through China CCGP, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This tender concerns the procurement of "UCIe-to-Serdes I/O Chips and Test Boards." The specific contracting authority is identified as 'zycgr21071303' in China, with China National United Engineering Corporation Ltd. serving as the tendering agency. This procurement is highly specialized, focusing on advanced semiconductor components essential for high-speed digital communication interfaces. UCIe (Universal Chiplet Interconnect Express) is a standard for connecting chiplets, while SerDes (Serializer/Deserializer) is crucial for converting parallel data to serial data for transmission over high-speed links. The tender likely seeks suppliers of integrated circuits (chips) that implement UCIe interfaces and SerDes technology, along with associated test boards or development kits. Typical requirements would include stringent technical specifications regarding data rates, power consumption, signal integrity, compliance with UCIe and other relevant standards, and reliability. Bidders are expected to possess advanced capabilities in semiconductor design and manufacturing. The procured components and boards will likely be used for research, development, or testing of next-generation computing or communication systems.

Data provenance

This notice is sourced from China CCGP and was originally published on November 4, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

About zycgr21071303

zycgr21071303 has issued 12 procurement notices on BidsFactory, including 2 currently open and 0 awarded contracts. Activity concentrates in Information & Communication Technology, General Supplies & Services, and Architecture & Engineering Services. All notices are published for China. Notices are distributed via China CCGP. Most recent publication: November 4, 2026.

Frequently asked questions about this tender

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.

How can I submit a bid?

Visit China CCGP to access the full notice, required documents, and submission instructions provided by the contracting authority.

Who is the contracting authority?

This notice was issued by zycgr21071303 in China. The authority is responsible for evaluating bids, awarding the contract, and managing performance.

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.