Guangzhou Guoxin Packaging Substrate Co., Ltd. Project - Ball Planting and Re-balling Machine - International Tender Announcement (1)

This tender announces the procurement of a ball planting and re-balling machine for Guangzhou Guoxin Packaging Substrate Co., Ltd., located in Guangdong Province, China. The project falls under the computer, communication, and other electronic equipment manufacturing industry, with funding provided via spot exchange. A ball planting and re-balling machine is specialized equipment used in semiconductor packaging processes. It is employed to attach solder balls (for ball grid array - BGA packages) to the substrate or to replace existing solder balls, a process known as re-balling. This is crucial for ensuring reliable electrical connections in advanced semiconductor packages. The machine ensures precise placement and consistent quality of solder balls, which is vital for the performance and reliability of the final electronic devices. Guangzhou Guoxin Packaging Substrate Co., Ltd. seeks a high-precision, automated machine to enhance its semiconductor packaging capabilities, ensuring the quality and integrity of its packaging substrates and contributing to the overall reliability of the electronic components it produces.