Semiconductor Chip Fabrication Service [HV BCD PMIC DIE]

Auto-translated from Korean

Original title: 반도체 칩 제작 서비스 [HV BCD PMIC DIE]

울산과학기술원

Published: Apr 1, 2026

Updated: May 4, 2026

Source: south_korea_pps

Summary

Translated

This tender is for semiconductor chip fabrication services, specifically for High Voltage Bipolar-CMOS-DMOS (HV BCD) Power Management Integrated Circuit (PMIC) Die. The procurement is being conducted by the Ulsan National Institute of Science and Technology (UNIST) (울산과학기술원). This service is crucial for developing and manufacturing advanced power electronics components. The contract method is general competition, and the bidding method is direct bidding (직찰), which is conducted electronically through the National Integrated Electronic Procurement System (나라장터). This procurement supports UNIST's research and development in semiconductor technology and advanced power systems.

Description

반도체 칩 제작 서비스 [HV BCD PMIC DIE]

Reference: 1100002766

Contract method: 일반경쟁

Bidding method: 직찰

Ordering institution: 울산과학기술원

Opening place: 국가종합전자조달시스템(나라장터)

About This Opportunity

This is a supplies contract in the energy and power, information and communication technology and governance and public administration sectors. Located in South Korea, Asia, this opportunity is open to firms and consortiums.

Published through South Korea PPS, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the energy and power sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.