Tenders/Low-cost chip-to-chip interface circuit chip prototyping, complete set
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Low-cost chip-to-chip interface circuit chip prototyping, complete set

Auto-translated from Japanese
Original title: 低コストチップ間インターフェース回路チップ試作 一式
The University of Tokyo (国立大学法人 東京大学)
Published: May 1, 2026
Updated: May 4, 2026
Source: jp_utokyo

Description

低コストチップ間インターフェース回路チップ試作 一式

発注機関: 国立大学法人 東京大学 (The University of Tokyo)
区分: 政府調達 入札公告
調達分野: 令和8年5月27日
公告日: 令和8年5月1日
書類提出期限: 令和8年6月17日
開札実施日: 本部契約課集中調達チームs-chotatsu.adm @ gs.mail.u-tokyo.ac.jp
問合せ部署: 入札説明書配布URL https://www.u-tokyo.ac.jp/ja/about/procurement-contracts/reverse.html →リバースオークション公開調達案件

About This Opportunity

This is a supplies contract in the education and training and Research sectors, with a focus on Higher Education. Located in Japan, Asia, this opportunity is open to firms and consortiums. Proposals must be submitted before June 17, 2026.

Published through University of Tokyo, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the education and training sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Key Details

Submission Deadline
Jun 17, 2026
44 days remaining
Contract Type
Supplies
Eligibility
Firms / Consortiums
Language
Japanese

Source

jp_utokyo
jp_utokyo
Official Source

Contracting Authority

The University of Tokyo (国立大学法人 東京大学)
🇯🇵Japan

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