Tenders/Guangzhou Guoxin Packaging Substrate Co., Ltd. Project - Solder Ball Flattening Machine (QP) [Re-tender] - International Tender Announcement (2)

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Guangzhou Guoxin Packaging Substrate Co., Ltd. Project - Solder Ball Flattening Machine (QP) [Re-tender] - International Tender Announcement (2)

Auto-translated from Chinese

Original title: 广州广芯封装基板有限公司项目-锡球压平机（QP）【重新招标】 - 国际招标公告(2)

Published: Apr 1, 2026

Updated: May 9, 2026

Source: ChinaBidding

Summary

Translated

This is a re-tender announcement for a solder ball flattening machine (QP) for the Guangzhou Guoxin Packaging Substrate Co., Ltd. project. The company is a manufacturer in the computer, communication, and other electronic equipment sector, based in Guangdong Province, China. The procurement is funded by spot exchange, with the tender number 0730-264010SZ0065/03. The re-tender status signifies a new opportunity for suppliers to bid on this specialized equipment. The machine is essential for the company's substrate production processes. This international tender invites bids from qualified suppliers who can meet the stringent technical specifications and quality standards required for semiconductor packaging operations. Interested bidders should carefully review the tender documents.

Description

0730-264010SZ0065/03,广州广芯封装基板有限公司项目-锡球压平机（QP）【重新招标】 | 行业: 计算机、通信和其他电子设备制造业 | 地区: 中国广东省 | 资金来源: 现汇

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About This Opportunity

This is a supplies contract in the information and communication technology sector. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.