Design Automation Tool License for Chip-to-Chip Interface, Complete Set
Description
チップ間インターフェース用設計自動化ツールライセンス 一式
発注機関: 国立大学法人 東京大学 (The University of Tokyo)
区分: 政府調達 随意契約による公示
公告日: 令和8年5月1日
開札実施日: 工学系・情報理工工学系等財務課調達チーム
About This Opportunity
This is a supplies contract in the education and training and Research sectors, with a focus on Higher Education. Located in Japan, Asia, this opportunity is open to firms and consortiums.
Published through University of Tokyo, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the education and training sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. This is an advance notice — the formal tender is expected to be published shortly. Interested parties can use this time to prepare documentation and identify potential partners.