Tenders/Hybrid Integrated Circuit Test System (Package 3) International Tender Announcement

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Hybrid Integrated Circuit Test System (Package 3) International Tender Announcement

Auto-translated from Chinese

Original title: 混合集成电路测试系统（标包3）国际招标公告

Published: Nov 3, 2026

Updated: Nov 4, 2026

Source: ChinaBidding

About This Opportunity

This is a supplies contract in the information and communication technology, audit and accounting and trade and industry sectors, with a focus on Asset Valuation and Manufacturing. Located in China, Asia, this opportunity is open to firms and consortiums.

Published through ChinaBidding, a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the information and communication technology sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. Interested parties should review the full documentation on the original source before submitting their proposal.

Description

Original language: Chinese

This international tender concerns the procurement of a hybrid integrated circuit test system, specifically for Package 3 (标包3). The contracting entity operates within the electrical machinery and equipment manufacturing industry and is located in Sichuan Province, China. The procurement will be financed through spot exchange. A hybrid integrated circuit test system is essential for verifying the functionality, performance, and reliability of complex electronic components that combine different types of semiconductor devices or technologies. The tender likely requires a sophisticated system capable of performing a wide range of electrical tests, diagnostics, and characterization for hybrid integrated circuits. Typical requirements include high-speed testing capabilities, advanced measurement accuracy, flexible test configurations, and robust data logging and analysis features. Bidders are expected to provide detailed technical specifications, evidence of system performance, and comprehensive support services, including installation, training, and ongoing maintenance. Adherence to relevant industry standards for electronic component testing is crucial. International manufacturers and suppliers with proven expertise in semiconductor and integrated circuit test equipment are invited to participate. Full tender documentation will detail the specific technical requirements, evaluation criteria, and submission procedures for this package.

Data provenance

This notice is sourced from ChinaBidding and was originally published on November 3, 2026. Last refreshed today. Original language: Chinese. BidsFactory mirrors official procurement notices and links back to the source for full legal text.

Frequently asked questions about this tender

How can I submit a bid?

Visit ChinaBidding to access the full notice, required documents, and submission instructions provided by the contracting authority.

What type of contract is this?

This is a Supplies contract in the Information & Communication Technology sector. The classification helps bidders match the opportunity to their qualifications and registered scope of supply.

Where will the contract be performed?

The contract is for delivery in China. Foreign bidders should review local registration, taxation, and any in-country presence requirements before submitting.