Wafer Probers

This tender concerns the procurement of wafer probers. Wafer probers are essential pieces of equipment used in the semiconductor manufacturing industry for testing integrated circuits (ICs) on silicon wafers before they are diced into individual chips. The process involves precisely contacting the electrical pads of each die on the wafer to perform electrical tests, thereby identifying functional and non-functional dies. This allows manufacturers to sort the good dies from the bad ones, optimizing yield and reducing costs in subsequent packaging and assembly stages. The specific requirements for the wafer probers, such as the type of testing capabilities (e.g., parametric, functional), probe card compatibility, wafer handling automation, throughput, and precision, are critical factors that will influence the selection of the appropriate equipment. The successful bidder will be expected to supply, and potentially install and commission, these advanced testing systems. Further details regarding technical specifications, delivery timelines, and evaluation criteria will be provided in the full tender documentation. This procurement is vital for maintaining and enhancing the capabilities of semiconductor fabrication facilities.

This is a supplies contract in the Research sector, with a focus on Laboratories and Scientific Research. Located in Austria, Europe, this opportunity is open to firms and consortiums, with an estimated budget of EUR 245,500.

Published through TED - Tenders Electronic Daily (EU), a national government procurement portal. Public procurement tenders follow the country's national bidding regulations and may have specific eligibility and documentation requirements for the supply of goods in the Research sector. Supply contracts typically require bidders to demonstrate product compliance with technical specifications, delivery capacity, and relevant certifications. This contract has already been awarded. The information is published for transparency and market intelligence purposes.